Multiscale modeling advances yield more reliable next-generation devices

Aug 7, 2026

Nuwan Dewapriya, associate scientist at the University of Delaware’s Center for Composite Materials, presented research at the Defense Advanced Research Projects Agency (DARPA) ARC CRYSTAL PI Meeting. The project demonstrates computational methods connecting atomistic simulations directly with engineering-scale models. By bridging these scales, the modeling provides detailed insights into material behavior at bonded interfaces under realistic operating conditions.

These computational tools help engineers predict interface performance under stress, lowering development risks and improving long-term reliability in advanced device design.

Review the presentation to examine the computational interface models.

Link to Presentation

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